Thermal Compound Application

[Kent10]

Hi:

I know this has probably been discussed much but I am still confused on how much grease to apply to a quad core processor.

Does this look about right in this picture
Thermal Compound Roundup | circuitREMIX

Or is it better to apply it in a line like Arctic Silver recommends. I am going to use the OCZ Freeze though for a change.
Thermal Compound Roundup | circuitREMIX

Some say grain of rice size, others say pea size, some say 4-5mm diameter drop and others 6-7mm.

Should I put the heatsink on and then remove it to make sure the entire processor looks covered as in this picture
Thermal Compound Roundup | circuitREMIX

What is too much? If it is oozing off the sides that would be too much I guess. Thanks. I want to do this right. Kent

[Capper]

Check this out;:

http://www.hardwarelogic.com/news/13...008-03-03.html

[Kent10]

Thanks for this Capper. I have read this before but had forgotten there was a section on application. For anyone else, here is the relevant part. So I guess the method is not important, just that it covers the whole processor evenly and doesn't run off the side. Thanks again.

"Ok, now that we've covered a few basics, there are three basic methods to applying thermal compound. The first is a small ball, or dab, of thermal compound placed on the middle of the processor's IHS. Then secure the HSF to the motherboard. The HSF will spread the thermal compound between the IHS and HSF, creating a bond.
The next method is used by several of the thermal compounds we'll be testing today. These thermal compounds will usually include an applicator so you can spread the thermal compound over the entire surface of the processor's IHS. Typically you'll spread the thermal compound in an even, extremely thin coat, then secure the HSF to the board.
The third method is recommended by Arctic Silver, long the standard for enthusiasts for their outstanding products. Using this method, you'll apply a thin line of thermal compound down the middle of the IHS.
Whichever method you use, I'd recommend seating the HSF on the board, then removing it to make sure you are getting a full and even coverage of the processor. Often, many people apply too much compound, which can cause some serious issues, not just with temperatures, but those using an electrically conductive thermal compound can actually kill their system if it comes into contact with electrical traces or capacitors. On the opposite end of the spectrum, using too little, or uneven application can cause issues such as poor heat transfer and high temperatures. So before you put your system together and fire it up, check your work and make sure the thermal compound is applied correctly."

[Tech Geek Deluxe]

I have always spread an even thin coating ... perfect to the edges with a razor blade on both the processor and the heatsink ... then I seat them together. There is more waste this way but every processor I pull off has a perfect even coat. There is only one compound that I found this method will not work with. [I did it anyway ... but only on the processor due to the thickness.] I still got 3 degrees better that AC5


Done this with the last 200 plus builds.