The best way to apply TIM..

[Computer-Ed]

I did an interview with Thermaltake today and we where discussing how TIM works and I asked him what the proper way to apply the compound was. He surprised me by saying that he found the spreading of a thin layer over the CPU was the method he had tested and found to be the best.

I had seriously assumed that he would say the bead or the dot of compound. So this brought up the idea to see what everyone here thought.

[gvblake22]

Well, it really depends on the type of chip you are applying the TIM to. If it has a bare core like a GPU, northbridge, or older CPU, then spreading it is the best way. If you are applying the TIM to an Integrated Heat Spreader (IHS), then it could go both ways, but generally people go with the small drop or bead in the center and then slide the heatsink around on it a bit to spread it out. If the IHS is lapped so you know it is flat, then spreading it may work better.

[Quakindude]

For an open core, I do it just as Blake describes. For an IHS though, I use Arctic Silver's recommended instructions. A thin line down the middle of the CPU from top to bottom, then set the HSF on the CPU and turn it back and forth. Clamp it down.

I had a guy at another set of forums tell me this and I thought he was full of crapola. But I tried it just the same. My CPU temps immediately dropped by 2-3*C over my old method of spreading it all around in a very thin layer across the top of the IHS.

[polobunny]

Small bead for me if I use AS5. That's what give me the best results.
If I use silicon I spread with a card, though I don't use silicon on my computers. :P

[Jokerswild]

I use one of the wife's business cards to spread a thin layer but I doubt it makes much difference how you do it as long as it creates a thin layer for the HSF.

[Capper]

I've always used a small bead, about the size of a grain of rice, placed right in the center. then put the heatsink on and wiggle it back and forth to spread it out. I'll usually remove the heatsink to make sure i have full coverage.

As important as applying the thermal compound is cleaning off the old stuff. Using 90% rubbing alcohol is fine, but I really recommend Arctic Silver Arctic clean

[Panda Man]

Small beard here! I always use a small bead on open cores and let the heatsink spread it to ensure it goes where its supposed to. It always ends up circular on my P4. If you spread it to parts the HSF doesn't make contact to, what's the point of having there?

[Tyreal]

For Processors with IHS, small bead in the centre and wiggle it a bit to spread it out.
For processors without an IHS, spread it out in a thin layer.

[screwballl]

Originally Posted by Quakindude

For an open core, I do it just as Blake describes. For an IHS though, I use Arctic Silver's recommended instructions. A thin line down the middle of the CPU from top to bottom, then set the HSF on the CPU and turn it back and forth. Clamp it down.

I had a guy at another set of forums tell me this and I thought he was full of crapola. But I tried it just the same. My CPU temps immediately dropped by 2-3*C over my old method of spreading it all around in a very thin layer across the top of the IHS.

I tried all 3 ways with my E6400 and E6600 and both gave me the best results using AS5 using the line method you described

[Quakindude]

Originally Posted by screwballl

I tried all 3 ways with my E6400 and E6600 and both gave me the best results using AS5 using the line method you described

Maybe there's an article in all of this. I've personally used three different methods with this same CPU and the thin line method returned the lowest temps.