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| | #11 | |
| Fields Join Date: Mar 2007 Location: Pacific Grove, CA
Posts: 4,459
| Quote:
![]() Last edited by Elysium; June 27th, 2007 at 18:17. | |
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| | #12 | |
| We take both criticism and positive comments very positively | Because you guys are curious.....I have a Biostar P35 board on its way....it should be here tomorrow. I'll post some initial thoughts on it tomorrow night, or Friday in the forums, with a review going up probably some time next week Quote:
Blake is 100% correct, passive cooled motherboards rely on a couple big principles. First, that the board will be mounted vertically, like an ATX tower case (if its not, the passive cooling is a waste, and even counterproductive). Second, that your case has good airflow, and for those overclocking, thats generally not enough.....you'll usually end up having to add additional fans over the chipsets. to keep them in a safe operating range. INTEL QX9650 // Gigabyte EP45 Extreme // 8GB PC2-8500 // BFG GTX260 MaxCore // DD Torture Rack // Seagate 750GB HDD // OCZ Vendetta // PC Power & Cooling 620W PSU | |
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| | #13 |
| Modder-ator | I have nothing against heatpipe cooling technology, even on motherboards. But the way the motherboard makers are going about it now is not what I had in mind. I would like to see better heatsink/heatpipe designs that cool the individual chips (or maybe only a couple lines of MOSFETs) at a time. Capper touched on some of the primary annoyances with elaborate heatpipe designs, but I would like to add the inability to upgrade cooling on any of the parts, as well as the problem with heat distrobution. It is sortof along the same lines as adding more and more and more components to a watercooling loop without much change in the radiator. The more heat you add to the loop, the hotter each component gets and/or the harder you have to work to cool it all down. The same can apply with heatpipe cooling that link everything together. Imagine the heat of a northbridge, southbridge, and 8-phase CPU power regulating chips all tossing heat into those three little sets of fins. It looks nice, and it's a nice idea (if implemented properly), but for many situations (particularly with high-power and high-heat chipsets), it is getting out of hand and not working as good as individualized cooling would. I hate actively cooled chipsets just as much as the next guy, but I would like to see better individually cooled passive heatpipe chipset cooling designs rather than this "spaghetti plate" of heatpipes connecting everything without much (if any) increase in heatsink fin surface area for cooling. |
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